Slump
Cause:
        Printing process operating in environmental conditions outside recommended range.
Action:
            Installation temperature control module to regulate temperature and humidity within printer.

Bleeding
Cause:
        Poor gasket between PCB and stencil, PCB support, squeegee pressure high, poor stencil or cleanliness
Action:
            Ensure stencil aperture size is smaller than pads on PCB, improve PCB support,reduce squeegee pressure, check stencil for damage.


Bridging

Cause:
        Stencil tension low, PCB support insufficient, poor cleanliness, poor paste quality
Action:
            Correct stencil tension, cleanliness, improve PCB support and verify paste quality
Paste in holes
Cause:
        Misprinted PCB, dirty PCB
Action:
            Fully clean PCB

Peaking
Cause:
        Stencil process speed too high, stencil condition/cleanliness or aperture damage
Action:
            Modify PCB separation speed, check stencil
Scooping
Cause:
        Squeegee pressure too high, stencil damaged or oversized apertures
Action:
            Optimize squeegee pressure, redesign stencil apertures to reduce size


Mis-alignment
Cause:
        Printer alignment error, PCB shrink or stretch, insufficient PCB support.
Action:
            Verify PCB to stencil alignment, fiducial marks are flat and well positioned
Incomplete Print
Cause:
        Blocked stencil aperatures, squeege pressure low, paste too cold or not well mixed
Action:
            Check paste, clean stencil, and adjust pressure